VTech thoroughly examines a product's structure and components, looking for fabrication or structural defects. The methods listed below, used alone or in combination, can provide the level of structural integrity verification we require. These tests include:

     Automated Optical Inspection (AOI) - This operation makes a visual image using cameras and lighting systems to examine boards for proper component placement and orientation, and inspect solder joints and traces for possible short or open circuits.

    Automated X-ray Inspection (AXI) - This operation utilizes an X-ray image of a board to provide a thorough inspection of all solder joints - including hidden joints in ball-grid-array components - and also examines overall component placement.

     In-Circuit Test (ICT) - This test uses a grid of electrical probes that make contact with a product's circuitry in order to measure actual component values, perform electrical tests for short and open circuits.