Contract Manufacturing Services


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VTech has fulfilled customers' PCBA and component packaging needs for more than 25 years. With the expertise and knowledge, VTech is able to utilize the most advanced packaging technologies, including:

	Surface Mount Technology (SMT)
	Pin Through Hole (PTH)
	Bare Die Attach (COB)
	Ball Grid Array (BGA)
	Fine Pitch Devices (Flip Chip)
	Miniature Resistor and Capacitor Array (down to 0201)
	Automated Connector Attach
	High Pin Count Press-fit
	Multiple Chip Module (MCM)
	Chip Scale Package

	Technology Solutions
	Technology Overview
	NPI Process
	Design Services
	Reliability Analysis
	Materials and Component
	Engineering
	Prototyping
	Test Development
	Manufacturing Process
	Design for Manufacturability
	Systems Assembly
	PCBA / Advanced Packaging